Mechanics and Reliability of Electronic Products Incorporating Aging Solder Joints

Abstract:  

Environmental concerns and legislation adopted in Europe and Asia have led to a nearly universal world-wide transition to lead free solders (so-called SAC alloys) in electronic products over the past 20 years. One of the greatest challenges has been that lead free solders are highly susceptible to aging effects, where their mechanical behavior and failure properties degrade with time when exposed to isothermal or variable temperature environments. Such degradations are caused by the unstable microstructures present at low temperatures, and they can lead to a significant reduction in the reliability of electronic products with time.