Nick Baker is an Assistant Professor at the University of Alabama, USA. He received his PhD from Aalborg University in 2016, which focused on Junction Temperature Measurements in Power Semiconductor Modules. In 2015, he was awarded the European Power Electronics Young Engineer Award in 2015. In 2015 and 2019, he was a guest researcher at the French Institute of Science and Technology in Versailles, France. From 2019 to 2021, he was an Independent Researcher funded by the Danish Independent Research Fund.
He is Technical Chair for the IEEE International Workshop on Power Packaging. He serves as a reviewer for the IEEE Journals of Power Electronics, Industrial Electronics, and Emerging and Selected Topics in Power Electronics. He also serves as a reviewer to several Power Electronics Conferences and for the German Research Foundation.
His research interests entail all aspects of the reliability of power semiconductor modules. His expertise includes junction temperature measurement, condition monitoring, accelerated lifetime testing, and development of custom and intelligent power modules. He is also focused on advanced material technology to enable ultra-reliable semiconductors, for example by using liquid-metal as an alternative to traditional packaging materials.