Dr. Qiang Huang’s group focuses on developing electrochemical technologies to fabricate new materials and structures for applications in microelectronics, renewable energy, and biomedical devices. Interconnect is a network of metal wires in integrated circuits, which enables the communication between semiconductor devices.
The state-of-the-art Cu interconnects is currently facing a big challenge, where Cu resistivity increases exponentially as the dimension of wires decreases. We are exploring the chemistry and process to enable the fabrication of interconnects with other metals, which do not suffer the same resistivity increase. In addition, we are investigating the electrodeposition of novel interconnects for quantum computers.
Chalcogenide compounds of transition metals find a variety of applications, including phase change memory, piezoelectric switches, thin film solar cells as well as electro- and photo catalysts. Our group is developing electrodeposited chalcogenide nanomaterials including thin films, nanowires and nanoparticles for those applications. Our research focuses on the understanding of nucleation and growth of such nanomaterials with a long term goal to make electrodeposition the viable process to fabricate memory devices.
Other focuses of our research include the development of a 3-D printing technology for metals based on electrodeposition. In addition, we are developing a biomedical device using electrochemically created nanomaterials. Anodization methods to create nanopore templates with controlled pore location and size are investigated. Furthermore, nanowires with compositional modulation at nanometer scale are fabricated.